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1. Ordering Information
CT41G |
-0805 |
-X7R |
-50V |
-0.1µF |
-K |
-N |
-T |
Series |
Case size |
Dielectric |
Rated voltage |
Capacitance |
Capacitance tolerance |
Termination Finish |
Packaging |
Class II Ceramic |
0201 |
X7R |
4V |
Refer to Capacitance and Rated Voltage Range |
J=±5% |
N=100% Sn |
T=7" Reel |
2. Features
1. This kind of capacitor’s series is CT41G
2. Operating temperature rang: -55℃ to +85℃ for X5R, and -55℃ to +125℃ for X7R.
3. Case size ranging from 0201 to 2225
3. Advantages
Torch brand products has leading technology and reliable quality. Our company has passed several certifications of management system.Such as ISO 9001:2015, ISO 14001:2015, GB/T28001-2011, Reach and ROHS. Up to now, Torch has obtained 37 invention patents, 106 utility model patents and 7 appearance patents.
4. Application
Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression, blocking and energy storage.
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5. Storage
Recommended conditions:
Temperature: Below 40℃, Humidity: Below 70% RH
Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 12 months from the time of delivery. If exceeding the above period, please check solderability before using the capacitors.
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6. FAQ
Q: What is the minimum order quantity?
A: It depends on the size of the product:
Size:0201 (L :0.6*W :0.3MM) MOQ:15000 PCS
Size:0402 (L :1.0*W :0.5MM) MOQ:10000 PCS
Size:0603 (L :1.6*W :0.8MM) MOQ:4000 PCS
Size:0805 (L :2.0*W :1.25MM) MOQ:3000 PCS
Size:1206 (L :3.2*W :1.6MM) MOQ:2000 PCS
Size:1812 (L :4.5*W :3.2MM) MOQ:1000 PCS
Size:2220 (L :5.7*W :5.0MM) MOQ:1000 PCS
Q: Can you send me the catalogue to have a check of all your products?
A: Yes, We could provide electronic product catalogue. Please contact us on line or send an Email to us.
Q: How to Buy?
A: You can send inquiry or PO to us.
7. Production process
A multilayer ceramic capacitor is completed as a chip, mainly through the following eight forming processes.
a.Printing of the internal electrodes on the dielectric sheet
b.Stacking of the dielectric sheets
c.Pressing process
d.Cutting process
e.Sintering process
f.Applying and baking the outer electrodes
g.Plating process
h.Measurement, and packaging process
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